60GHz-Band Flip-Chip MMIC Modules for IEEE1394 Wireless Adapters

Abstract

60GHz-band 500-Mpbs transmitter and receiver multi-chip modules (MCMs) are presented, in which MMICs and a filter are mounted using flip-chip bonding technique. A multi-layer Low Temperature Co-fired Ceramic (LTCC) substrate is adopted for a package. The MCMs are directly bonded with printed wiring boards using ball grid array technique, achieving connections for signals and biasing. A developed 500-Mbps ASK transceiver exhibits an average output power of 10dBm and a minimum received power of -55dBm. The transceiver is applied to the IEEE1394 wireless adapter which demonstrates 17-m communication distance in line of sight.