Publication | Closed Access
Effect of underfill on electromigration lifetime in flip chip joints
20
Citations
20
References
2009
Year
Materials EngineeringElectrical EngineeringElectromigration TechniqueEngineeringAdvanced Packaging (Semiconductors)MicrofabricationChip On BoardInterconnect (Integrated Circuits)Applied PhysicsChip AttachmentElectronic PackagingMicroelectronicsFlip Chip Joints
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|---|---|---|
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