The temperature dependence of component failure rate

Thermally accelerated aging of semiconductor components

F.H. Reynolds · Proceedings of the IEEE · 1974 · 71 citations

Engineering, Electrical Engineering, Materials Science +17

Accelerated Life Testing of Flexible Printed Circuits

P. J. Boddy, R. H. Delaney, J. N. Lahti et al. · Reliability physics · 1976 · 32 citations

Engineering, Materials Engineering, Materials Science +16

Research Toward a Physics of Aging of Electronic Component Parts

R. Edward Thomas, H. C. Gorton · 1963 · 14 citations

Natural Sciences, Materials Science, Physics +12

Accelerated vibration fatigue life testing of leads and soldered joints

Henry S. Blanks · Microelectronics Reliability · 1976 · 11 citations

Engineering, Materials Engineering, Materials Science +8