Physical Review Letters · 1998 · 312 citations · 21 references
EngineeringMaterials EngineeringMaterials ScienceElectronic MaterialsPhysical ChemistrySemiconductor MaterialsCarrier TransportDiffusion In SolidsSemiconductor Device MaterialsSemiconductor HeterostructuresSemiconductor PhysicsSilicon MaterialsDiffusion CoefficientsDiffusion In HeterostructuresEnthalpySecondary Ion Mass SpectrometrySelf-diffusionSelf-interstitialsTemperature DependenceTemperature Dependence Of Diffusion
Self-diffusion of silicon is measured between 855 and 1388 \ifmmode^\circ\else\textdegree\fi{}C in highly isotopically enriched ${}^{28}\mathrm{Si}$ layers. The profiles of ${}^{29}\mathrm{Si}$ and ${}^{30}\mathrm{Si}$ are determined by secondary ion mass spectrometry. Temperature dependence of the self-diffusion coefficients is accurately described over seven orders of magnitude with one diffusion enthalpy of 4.75 eV. This single enthalpy indicates that self-interstitials dominate self-diffusion. The high accuracy of our data enables us to estimate an upper bound for the vacancy-assisted diffusion enthalpy of 4.14 eV, which agrees with recent theoretical calculations.
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Point defects and dopant diffusion in silicon
P. Fahey, Peter B. Griffin, J.D. Plummer · Reviews of Modern Physics · 1989 · 1.4K citations
<i>Point Defects in Metals</i>
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Correlation factors for diffusion in solids
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