Publication | Open Access

In situ observations on deformation behavior and stretching-induced failure of fine pitch stretchable interconnect

EngineeringSevere Plastic DeformationFlexible ElectronicsDeformation BehaviorMechanicsSitu ObservationsMechanical EngineeringApplied PhysicsStressstrain AnalysisAdvanced Packaging (Semiconductors)Electronic PackagingMechanical DeformationMechanics Of MaterialsStretching-induced Failure