Shear strength and wettability of active Sn3.5Ag4Ti(Ce,Ga) solder on Al2O3 ceramics

Ultrasonic assisted fabrication of particle reinforced bonds joining aluminum metal matrix composites

Jiuchun Yan, Zhiwu Xu, Lei Shi et al. · Materials & Design (1980-2015) · 2010 · 97 citations

Engineering, Materials Engineering, Materials Science +14

Low Temperature Bonding of Alumina/Alumina and Alumina/Copper in Air Using Sn3.5Ag4Ti(Ce,Ga) Filler

Shih‐Ying Chang, Tung‐Han Chuang, Ching-Feng Yang · Journal of Electronic Materials · 2007 · 56 citations

Natural Sciences, Materials Engineering, Materials Science +13

Reaction layers and mechanisms for a Ti-activated braze on sapphire

J.J. Stephens, F.M. Hosking, T.J. Headley et al. · Metallurgical and Materials Transactions A · 2003 · 54 citations

Natural Sciences, Materials Engineering, Materials Science +4

Joining of sapphire and hot pressed Al2O3 using Ag70.5Cu27.5Ti2 brazing filler metal

Honglong Ning, Zhiting Geng, Jusheng Ma et al. · Ceramics International · 2003 · 49 citations

Engineering, Materials Engineering, Materials Science +12

Tin-based reactive solders for ceramic/metal joints

Rakesh Kapoor, Thomas W. Eagar · Metallurgical Transactions B · 1989 · 46 citations

Natural Sciences, Materials Engineering, Materials Science +11