Thermal Contact Conductance of Adhesives for Microelectronic Systems

Abstract

Adhesives, which are often used to attach a silicon device to a heat spreader or ceramic substrate, generally increase the heat transfer across the material junction and improve the thermal contact conductance. This investigation evaluated the effect of RTV and epoxy adhesives and high-temperature cements on the thermal contact conductance between aluminum 6106-T6 and aluminum 356-T61. The thermal contact conductance was evaluated at mean interface temperatures of 25 and 60°C (77 and 140°F) and at pressures ranging from 345 to 2756 kPa (50 to 400 psi). The thermal contact conductance values of these adhesives were not significantly affected by variations in specified interface temperature or pressure, however, adhesive thickness and thermal conductivity were influential in the measured conductance.