MRS Proceedings · 1989 · 15 citations · 2 references
EngineeringElectrical EngineeringMaterials ScienceElectronic MaterialsMicroelectronicsSemiconductor DevicesDevice ReliabilityIntegrated Circuit DesignIntegrated Circuit DevicesIntegrated Circuit FabricationInterconnect TechnologyWafer BondingAdhesion LayersInterconnect FabricationWire Bonding
2
Thermal Stress in Bonded Joints
W. T. Chen, C. W. Nelson · IBM Journal of Research and Development · 1979 · 322 citations
Microelectronics packaging handbook
Keg Pitt · Microelectronics Journal · 1989 · 111 citations