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Composition depth profiles of oxidized silicon and sputtered GaAs from angle-resolved x-ray photoelectron spectroscopy
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Citations
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1988
Year
EngineeringSilicon On InsulatorSemiconductor DeviceSemiconductorsLaplace TransformsEpitaxial GrowthCompound SemiconductorElectrical EngineeringBulk CompositionPhysicsSemiconductor Device FabricationMicroelectronicsOptoelectronicsSurface AnalysisSurface ScienceApplied PhysicsComposition Depth ProfilesSurface SegregationOxidized Silicon
An inverse Laplace transform method has been used to extract composition depth profiles from angle-resolved x-ray photoelectron spectroscopy data from oxidized Si and Ar+ bombarded GaAs. An iterative procedure determines a least-squares curve fit of the data using the Laplace transforms of step functions, which are summed to yield the composition profiles. For a sample of native oxide on a Si wafer, the composition profile defines the thickness and chemical layering of the various silicon oxide states. For GaAs sputtered with 1.5-, 3.0-, and 5.0-keV Ar+, the composition depth profiles show a surface composition near the bulk ratio, a subsurface As depletion, the extent of which increases with increasing ion energy, then a return to the bulk composition at greater depth. These As composition profiles result from preferential sputtering caused by surface segregation enhanced by sputter-assisted diffusion in the near surface region.
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