Effect of Ag and Cu Concentrations on the Creep Behavior of Sn-Based Solders

Theory of Steady-State Creep Based on Dislocation Climb

J. Weertman · Journal of Applied Physics · 1955 · 658 citations

Natural Sciences, Materials Engineering, Materials Science +17

Constitutive relations for tin-based solder joints

Robert Darveaux, K. Banerji · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1992 · 469 citations

Natural Sciences, Materials Engineering, Materials Science +17

Effects of cooling speed on microstructure and tensile properties of Sn–Ag–Cu alloys

K.S Kim, Seok‐Hwan Huh, Katsuaki Suganuma · Materials Science and Engineering A · 2002 · 378 citations

Natural Sciences, Materials Engineering, Materials Science +11

A model for steady state creep based on the motion of jogged screw dislocations

C. R. Barrett, William D. Nix · Acta Metallurgica · 1965 · 368 citations

Natural Sciences, Materials Science, Mechanical Engineering +13

Creep deformation behavior of Sn–3.5Ag solder/Cu couple at small length scales

Matthew Kerr, Nikhilesh Chawla · Acta Materialia · 2004 · 218 citations

Natural Sciences, Materials Engineering, Materials Science +16