Electrical and thermal stability of Ag ohmic contacts for GaN-based flip-chip light-emitting diodes by using an AgAl alloy capping layer

Yoon Tae Hwang, Hyun-Gi Hong, Tae‐Yeon Seong, Dong‐Seok Leem, T. Lee, K. K. Kim, June O Song

Materials Science in Semiconductor Processing · 2007 · 11 citations · 17 references

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