Tantalum oxide as an alternative low height tunnel barrier in magnetic junctions

Abstract

Magnetic tunnel junctions with a barrier of tantalum oxide were prepared by plasma oxidation of sputter-deposited tantalum. They show magnetoresistance ratios of 2.5% at room temperature and 4% at low temperatures. The material exhibits low barrier heights of ∼0.4 eV. This makes it possible to substantially increase the barrier thickness, compared to a barrier of aluminum oxide. The resulting decrease of coupling between the ferromagnetic layers is easily seen. Tantalum oxide appears to be a candidate for use as a tunnel barrier of spin-dependent tunneling devices.