The effect of tin grain structure on whisker growth

Interdiffusion and reaction in bimetallic Cu-Sn thin films

K. N. Tu · Acta Metallurgica · 1973 · 485 citations

Natural Sciences, Materials Engineering, Materials Science +10

Kinetics of interfacial reaction in bimetallic CuSn thin films

K. N. Tu, R. D. Thompson · Acta Metallurgica · 1982 · 468 citations

Natural Sciences, Materials Engineering, Materials Science +14

Spontaneous growth mechanism of tin whiskers

D.N. Lee · Acta Materialia · 1998 · 426 citations

Natural Sciences, Materials Science, Cell Proliferation +1

Spontaneous Growth Mechanism of Tin Whiskers

B Z Lee · Acta Metallurgica · 1998 · 407 citations

Natural Sciences, Materials Science, Cell Proliferation +1

Spontaneous whisker growth on lead-free solder finishes

K. N. Tu, J.C.M. Li · Materials Science and Engineering A · 2005 · 189 citations

Engineering, Materials Engineering, Materials Science +7