Length Distribution Analysis for Tin Whisker Growth

Abstract

The global movement to lead-free electronics has led semiconductor device assemblers to switch terminals and finishes from lead-based to pure tin or high tin lead-free alloys. This transition has resulted in a reliability concern associated with the formation of conductive tin whiskers, which can grow from a device terminal or lead and cause current leakage or short circuits. This paper presents the results of an experimental study on tin whisker growth. Test specimens consisted of matte and bright tin finishes on copper, Alloy-42, and brass substrate materials. The heat treatments included annealing and two types of simulated reflow. Maximum whisker length and whisker density were measured on 24 different types of tin-plated specimens, after three, eight, and 16 months of room ambient storage after various heat treatments