Plasma deposition of conductive polymer composites for strain sensor applications

Abstract

The aim of this work is to develop a large area thin film of a conductive polymer composite (CPC) for large area strain sensor applications. Therefore an alternative plasma deposition process is applied for the manufacturing of CPC as flexible thin films. Plasma polymer films are used as matrix that are deposited with a 60MHz plasma reactor and characterized with dynamic mechanical analyzes (DMA). Copper nanoparticles with different sizes are generated in a special hollow cathode. To enhance the sensitivity of the strain sensor a particle concentration in the matrix at the percolation threshold is important. For this reason, in situ U/I-measurements during particle deposition were done. The characteristics of resistance of the CPC films are analyzed during elongation.