Y<sub>1</sub>Ba<sub>2</sub>Cu<sub>3</sub>O<sub>7–<i>x</i></sub>multilayer structures with a thick SiO<sub>2</sub>interlayer for multichip modules - Concepedia

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Y<sub>1</sub>Ba<sub>2</sub>Cu<sub>3</sub>O<sub>7–<i>x</i></sub>multilayer structures with a thick SiO<sub>2</sub>interlayer for multichip modules

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Citations

22

References

1997

Year

S. Afonso, K. Y. Chen, Qihua Xiong, Y. Q. Tang, Greg Salamo, F. T. Chan, J.W. Cooksey, Steven Scott, Yue-Jie Shi, Simon S. Ang,

Journal of materials research/Pratt's guide to venture capital sources

References

	Year	Citations

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