An investigation of Sn pest in pure Sn and Sn-based solders

Creep deformation behavior of Sn–3.5Ag solder/Cu couple at small length scales

Matthew Kerr, Nikhilesh Chawla · Acta Materialia · 2004 · 218 citations

Natural Sciences, Materials Engineering, Materials Science +16

Determination of the eutectic structure in the Ag-Cu-Sn system

Daniel Lewis, S.L. Allen, Michael R. Notis et al. · Journal of Electronic Materials · 2002 · 88 citations

Natural Sciences, Materials Engineering, Materials Science +12

Improved Drop Reliability Performance with Lead Free Solders of Low Ag Content and Their Failure Modes

Hyunchul Kim, Mu Zhang, Chetan Kumar et al. · 2007 · 78 citations

Engineering, Materials Engineering, Materials Science +17

Aging and creep behavior of Sn3.9Ag0.6Cu solder alloy

Qiang Xiao, Luu Nguyen, W. D. Armstrong · 2004 · 71 citations

Natural Sciences, Materials Engineering, Materials Science +17

Finding Solutions to the Challenges in Package Interconnect Reliability

Luke J. Garner · Intel Technology Journal · 2005 · 56 citations

Engineering, Computer Engineering, Electrical Engineering +12