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Eliminating stacking faults in semi-polar GaN by AlN interlayers
22
Citations
17
References
2011
Year
Aluminium NitrideWide-bandgap SemiconductorEngineeringCrystalline DefectsPhysicsSurface ScienceApplied PhysicsLow-temperature Aln InterlayersAluminum Gallium NitrideGan Power DeviceAln InterlayersElimination MechanismCategoryiii-v SemiconductorSemi-polar Gan
We report on the elimination of stacking faults by the insertion of low-temperature AlN interlayers in nearly (1016) and (11¯04) oriented semi-polar GaN grown by metalorganic vapor phase epitaxy on Si(112) and Si(113), respectively. The elimination of these defects is visualized by cathodoluminescence (CL) as well as scanning transmission electron microscopy (STEM) and STEM-CL. A possible annihilation mechanism is discussed which leads to the conclusion that the elimination mechanism is most likely valid for all layers with (11¯01) surfaces, enabling heteroepitaxial semi- and non-polar GaN free from stacking faults.
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