Variable eutectic temperature caused by inhomogeneous solute distribution in Sn–Zn system

Microstructure evolution of eutectic Sn-Ag solder joints

Wenge Yang, Robert W. Messler, L.E. Felton · Journal of Electronic Materials · 1994 · 270 citations

Materials Science, Materials Engineering, Friction Welding +5

Creep, stress relaxation, and plastic deformation in Sn-Ag and Sn-Zn eutectic solders

H. Mavoori, Jason Chin, Semyon Vaynman et al. · Journal of Electronic Materials · 1997 · 234 citations

Materials Science, Materials Engineering, Plastic Deformation +13

Effect of composition and cooling rate on microstructure and tensile properties of Sn–Zn–Bi alloys

Young‐Sun Kim, Keun‐Soo Kim, Chi-Won Hwang et al. · Journal of Alloys and Compounds · 2003 · 227 citations

Materials Science, Materials Engineering, Engineering +7

New lead-free, Sn-Zn-In solder alloys

M. McCormack, S. Jin, H. S. Chen et al. · Journal of Electronic Materials · 1994 · 148 citations

Materials Science, Materials Engineering, Engineering +5

Thermodynamics-aided alloy design and evaluation of Pb-free solder, SnBiInZn system

Seung Wook Yoon, Jeong Ryong Soh, Hyuck Mo Lee et al. · Acta Materialia · 1997 · 128 citations

Materials Science, Engineering, Mechanical Engineering +2