IEEE Electron Device Letters · 1995 · 19 citations · 13 references
EngineeringElectrical EngineeringMaterials ScienceElectronic MaterialsSemiconductor DevicesSemiconductor MaterialsComplementary Metal-oxide-semiconductor TechnologyDevice CharacterizationSemiconductor Device MaterialsSemiconductor InterfacesThin-film TransistorsWide-bandgap Semiconductor DevicesCapacitance-voltage CharacteristicsElectronic Trap StatesHysteresisInterface StatesInterface Trap StatesPassivation TechniquesTransconductanceTrap States
High performance enhancement mode InP MISFET's have been successfully fabricated by using the sulfide passivation for lower interface states and with photo-CVD grown P/sub 3/N/sub 5/ film used as gate insulator. The MISFET's thus fabricated exhibited exhibited pinch-off behavior with essentially no hysteresis. Furthermore the device showed a superior stability of drain current. Specifically under the gate bias of 2 V for 10/sup 4/ seconds the room temperature drain current was shown to reduce from the initial value merely by 2.9% at the drain voltage of 4 V. The effective electron mobility and extrinsic transconductance are found to be about 2300 cm/sup 2V/spl middot/s and 2.7 mS/mm, respectively. The capacitance-voltage characteristics of the sulfide passivated InP MIS diodes show little hysteresis and the minimum density of interface trap states as low as 2.6/spl times/10/sup 14cm/sup 2/ eV has been attained.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">></ETX>
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Haruhiro Oigawa, Jia-Fa Fan, Yasuo Nannichi et al. · Japanese Journal of Applied Physics · 1991 · 247 citations
Natural Sciences, Materials Engineering, Materials Science +17
Sulfur as a surface passivation for InP
R. Iyer, R. Chang, D. L. Lile · Applied Physics Letters · 1988 · 145 citations