Oxygen and Water Plasma‐Immersion Ion Implantation of Copper into Titanium for Antibacterial Surfaces of Medical Implants

Abstract

Abstract Plasma‐immersion ion implantation (PIII) is used for the insertion of copper into titanium and its alloys to impart antimicrobial properties. Physicochemical changes inside the subsurface of titanium are investigated after PIII with either oxygen or water vapor. O 2 ‐Cu‐PIII produces copper oxides inside the surface of the titanium oxide; H 2 O‐Cu‐PIII produces metallic copper inside the created titanium oxide compound. The length of the PIII pulses can exert control over the ion flux and the substrate temperature. H 2 O‐Cu‐PIII produces rutile structures with copper inside the lattice. The antimicrobial activity is tested with bacteria and the cytocompatibility with osteoblasts is investigated.