Interfacial microstructure and strength of partial transient liquid-phase bonding of silicon nitride with Ti/Ni multi-interlayer

Modelling of transient liquid phase bonding

Y. Zhou, William F. Gale, T. H. North · International Materials Reviews · 1995 · 221 citations

Engineering, Materials Engineering, Materials Science +12

The reactive route to ceramic joining: Fabrication, interfacial chemistry and joint properties

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Natural Sciences, Materials Engineering, Materials Science +16

Nanostructure of wetting triple line in a Ag–Cu–Ti/Si3N4 reactive system

Masahiro Nomura, Chihiro Iwamoto, S. Tanaka · Acta Materialia · 1999 · 73 citations

Natural Sciences, Materials Engineering, Materials Science +12

Kinetic and microstructural aspects of the reaction layer at ceramic/metal braze joints

Wolfgang Tillmann, E. Lugscheider, Rongfu Xu et al. · Journal of Materials Science · 1996 · 50 citations

Engineering, Materials Engineering, Materials Science +16

Interfacial microstructure of partial transient liquid phase bonded Si3N4-to-Inconel 718 joints

Jae Joong Kim, Jin‐Woo Park, Thomas W. Eagar · Materials Science and Engineering A · 2002 · 49 citations

Engineering, Materials Engineering, Materials Science +16