Influence of N content on microstructure and thermal stability of Ta–N thin films for Cu interconnection - Concepedia

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Influence of N content on microstructure and thermal stability of Ta–N thin films for Cu interconnection

34

Citations

16

References

2002

Year

M. Hecker, D. Fischer, Volker Hoffmann, H. Engelmann, N. Mattern, Christian Wenzel, Carla Vogt, Ehrenfried Zschech

Thin Solid Films

Materials EngineeringN ContentMaterials ScienceMaterial AnalysisEngineeringApplied PhysicsThermal PropertyCu InterconnectionThin Film Process TechnologyThin FilmsThermal StabilityThin Film ProcessingInterconnect (Integrated Circuits)

References

	Year	Citations

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