Characterization and application of aggregated porous copper oxide flakes for cupric source of copper electrodeposition

Fabrication of copper oxide multilayer nanosheets for supercapacitor application

Deepak P. Dubal, Dattatray S. Dhawale, Rahul R. Salunkhe et al. · Journal of Alloys and Compounds · 2009 · 367 citations

Natural Sciences, Materials Engineering, Materials Science +14

A convenient alcohothermal approach for low temperature synthesis of CuO nanoparticles

Zhong-shan Hong, Yong Cao, Jing‐Fa Deng · Materials Letters · 2002 · 265 citations

Natural Sciences, Chemistry, Materials Science +14

Microvia filling by copper electroplating using diazine black as a leveler

Wei‐Ping Dow, Chih-Chan Li, Yong-Chih Su et al. · Electrochimica Acta · 2009 · 162 citations

Engineering, Chemical Engineering, Materials Engineering +7

Via-filling using electroplating for build-up PCBs

Takeshi Kobayashi, Junichi Kawasaki, Kuniaki Mihara et al. · Electrochimica Acta · 2001 · 115 citations

Engineering, Materials Engineering, Materials Science +6

Fabrication of Malachite with a Hierarchical Sphere-like Architecture

Jiasheng Xu, Dongfeng Xue · The Journal of Physical Chemistry B · 2005 · 110 citations

Natural Sciences, Materials Engineering, Materials Science +13