Variation in diffusion-induced solidification rate of liquated Ni–Cr–B insert during TLP bonding of Waspaloy superalloy

A study of the transient liquid phase bonding process applied to a Ag/Cu/Ag sandwich joint

Isaac Tuah-Poku, M. Dollár, T. B. Massalski · Metallurgical Transactions A · 1988 · 330 citations

Engineering, Materials Engineering, Materials Science +11

TLP bonding: a new method for joining heat resistant alloys

D. S. Duvall, W.A. Owczarski, D.F. Paulonis · Welding Journal · 1974 · 263 citations

Engineering, Materials Engineering, Materials Science +13

Microstructural development in transient liquid-phase bonding

William F. Gale, E. R. Wallach · Metallurgical Transactions A · 1991 · 143 citations

Natural Sciences, Materials Engineering, Materials Science +14

Effect of bonding temperature on isothermal solidification rate during transient liquid phase bonding of Inconel 738LC superalloy

O.A. Idowu, N.L. Richards, M.C. Chaturvedi · Materials Science and Engineering A · 2005 · 122 citations

Engineering, Materials Engineering, Materials Science +16

Effect of gap size and process parameters on diffusion brazing of Inconel 738

O.A. Ojo, N.L. Richards, M.C. Charturvedi · Science and Technology of Welding & Joining · 2004 · 100 citations

Natural Sciences, Materials Engineering, Materials Science +13