Concepedia

Investigation of Ta grain boundary diffusion in copper by means of Auger electron spectroscopy

G. Erdélyi, G.A. Langer, J. Nyéki, L. Kövér, C. Tomastik, Wolfgang Werner, A. Csík, Herbert Stoeri, Dezső L. Beke

Thin Solid Films · 2004 · 15 citations · 7 references

DOI

Concepts

References

7

The surface energy of metals

Levente Vitos, A. V. Ruban, H. L. Skriver et al. · Surface Science · 1998 · 2.7K citations

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Thermal stability of a Cu/Ta multilayer: an intriguing interfacial reaction

Hoo-Jeong Lee, Kee-Won Kwon, Changsup Ryu et al. · Acta Materialia · 1999 · 111 citations

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Measurement of grain-boundary diffusion at low temperature by the surface-accumulation method. II. Results for gold-silver system

James C. M. Hwang, Jiahui Pan, R. W. Balluffi · Journal of Applied Physics · 1979 · 70 citations

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Diffusion in several materials relevant to Cu interconnection technology

D. Gupta · Materials Chemistry and Physics · 1995 · 64 citations

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Thermal stability of amorphous and crystalline multilayers produced by magnetron sputtering

D.L. Beke, G. A. Langer, M. Kis‐Varga et al. · Vacuum · 1998 · 27 citations · Full text

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