Publication | Closed Access
Diffusion in several materials relevant to Cu interconnection technology
63
Citations
15
References
1995
Year
Materials ScienceMaterials EngineeringElectromigration TechniqueEngineeringDiffusion ResistanceApplied PhysicsTransport PhenomenaElectronic PackagingCu Interconnection TechnologyInterconnect (Integrated Circuits)
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