Study of low temperature MOCVD deposition of TiN barrier layer for copper diffusion in high aspect ratio through silicon vias - Concepedia

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Study of low temperature MOCVD deposition of TiN barrier layer for copper diffusion in high aspect ratio through silicon vias

34

Citations

4

References

2013

Year

Larissa Djomeni, Thierry Mourier, Stéphane Minoret, Sabrina Fadloun, Fabien Piallat, Steve Burgess, Andrew Price, Yun Zhou, Christopher J. Jones, D. Mathiot

Microelectronic Engineering

Materials ScienceMaterials EngineeringElectrical EngineeringCopper DiffusionEngineeringNanoelectronicsSurface ScienceApplied PhysicsTin Barrier LayerSemiconductor Device FabricationHigh Aspect RatioElectronic PackagingChemical DepositionMicroelectronicsChemical Vapor Deposition

References

	Year	Citations

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