Abrasive electrochemical multi-wire slicing of solar silicon ingots into wafers

Analysis of Mirror Surface Generation of Hard and Brittle Materials by ELID (Electronic In-Process Dressing) Grinding with Superfine Grain Metallic Bond Wheels

Hitoshi Ohmori, Takeo Nakagawa · CIRP Annals · 1995 · 214 citations

Engineering, Materials Engineering, Materials Science +14

Investigation of silicon wafering by wire EDM

Yuxuan Luo, C. G. Chen, Zheming Tong · Journal of Materials Science · 1992 · 70 citations

Engineering, Manufacturing Engineering, Materials Science +14

Silicon Surface Passivation by Organic Monolayers:  Minority Charge Carrier Lifetime Measurements and Kelvin Probe Investigations

Alexander B. Sieval, Carolien L. Huisman, Axel Schönecker et al. · The Journal of Physical Chemistry B · 2003 · 68 citations

Natural Sciences, Chemistry, Materials Science +17

Study of electrical discharge machining technology for slicing silicon ingots

Wen Yang Peng, Yi‐Hung Liao · Journal of Materials Processing Technology · 2003 · 63 citations

Engineering, Electrical Engineering, Manufacturing Engineering +11

Development of a High-Speed Manufacturing Method for Electroplated Diamond Wire Tools

Younes Chiba, Yukako Tani, Toshiki Enomoto et al. · CIRP Annals · 2003 · 50 citations

Engineering, Manufacturing Engineering, Materials Engineering +8