Microstructural evolution of Sn–9Zn–3Bi solder/Cu joint during long-term aging at 170°C

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Wetting and interface microstructure between Sn–Zn binary alloys and Cu

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Effect of soldering and aging time on interfacial microstructure and growth of intermetallic compounds between Sn-3.5Ag solder alloy and Cu substrate

Won Kyoung Choi, Hyuck Mo Lee · Journal of Electronic Materials · 2000 · 192 citations

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