The Euler bend: paving the way for high-density integration on micron-scale semiconductor platforms

Abstract

We present our recent breakthrough for high density integration in micron-scale thick semiconductor platforms. The novel bend concept is presented from a theoretical point of view and supported by experimental results on silicon strip waveguides, including the smallest low-loss bends ever reported for an optical waveguide. Some experimental example applications to resonators, spirals, and Mach-Zehnder interferometers are also presented, along with envisaged applications to other semiconductor platforms. A special focus will be dedicated to potential applications in III-V platforms, where the novel bend could lead to unprecedented dense integration of devices as well as to novel concepts for active components.