Concepedia

Effect of nitric acid on wet etching behavior of Cu/Mo for TFT application

Bo‐Hyun Seo, Sang-Hyuk Lee, Insun Park, Jong Hyun Seo, HeeHwan Choe, Jae‐Hong Jeon, MunPyo Hong

Current Applied Physics · 2010 · 26 citations · 2 references

DOI

Concepts

References

2

Copper metallization for ULSL and beyond

S. P. Murarka, Steven W. Hymes · Critical reviews in solid state and materials sciences/CRC critical reviews in solid state and materials sciences · 1995 · 260 citations

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Electrochemical Equilibria of Copper in Aqueous Phosphoric Acid Solutions

Serdar Aksu · Journal of The Electrochemical Society · 2009 · 47 citations

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