Concepedia

Influence of the interface structure on the thermo-mechanical properties of Cu–X (X=Cr or B)/carbon fiber composites

Amélie Veillère, Jean‐Marc Heintz, N. Chandra, J. Douin, M. Lahaye, Grégory Lalet, Cécile Vincent, Jean‐François Silvain

Materials Research Bulletin · 2011 · 46 citations · 10 references

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Concepts

References

10

Performance and testing of thermal interface materials

J.P. Gwinn, Ralph L. Webb · Microelectronics Journal · 2003 · 359 citations

Advances in composite materials for thermal management in electronic packaging

Carl Zweben · JOM · 1998 · 352 citations

, , +8

Thermal conductivity of SPS consolidated Cu/diamond composites with Cr-coated diamond particles

Ke Chu, Zhaofang Liu, Chengchang Jia et al. · Journal of Alloys and Compounds · 2009 · 293 citations

, , +10

On the influence of active element content on the thermal conductivity and thermal expansion of Cu–X (X=Cr, B) diamond composites

L. Weber, Reza Tavangar · Scripta Materialia · 2007 · 287 citations · Full text

, , +7

Interfacial characterization of Cu/diamond composites prepared by powder metallurgy for heat sink applications

Tim Schubert, Ł. Ciupiński, Witold Zieliński et al. · Scripta Materialia · 2007 · 280 citations

, , +6