Performance and testing of thermal interface materials

TLDR

The increasing power and reduced die size of CPUs necessitate improved thermal interface materials to reduce contact resistance at the CPU–heat sink interface. The study aims to provide a state‑of‑the‑art assessment of thermal interface materials and to recommend design and operation of an apparatus that simulates real computer installation conditions. The authors evaluate interface resistance and describe a low‑melting‑point alloy TIM, comparing it to commercial materials. The report presents performance data of new commercial TIMs, discusses their pros and cons, and notes that the recommended test method may not replicate real installation conditions.

Abstract

The increasing power and reduced die size of CPUs used in computers increases a need for significantly improved thermal interface materials (TIM). The TIM is used to reduce contact resistance at the CPU–heat sink interface. This work provides a state-of-the-art assessment on 'thermal interface materials', including fundamentals, materials used, their performance, and how interface resistance is measured. The performance of new commercial interface materials is given, as well as discussion of the advantages and disadvantages of different materials. The report notes that the recommended interface test method does not necessarily duplicate the installation and operating conditions in an actual computer installation. Recommendations are presented on the design and operation of an apparatus intended to simulate actual computer installation conditions. The innovative Penn State 'low melting point alloy' thermal interface material is described and compared to other commercial materials.