Japanese Journal of Applied Physics · 2010 · 20 citations · 8 references
Natural SciencesMaterials EngineeringMaterials ScienceCeramic MaterialsCeramicsThin Films3D PrintingFabrication MaterialsHybrid FabricationHybrid MaterialsPackaging MaterialsPrinting TechniquesAlumina Thin FilmsHybrid Ceramic MaterialsMicrowave Dielectric PropertiesPermittivityPermittivity MeasurementResin Material Properties
We used the inkjet printing to fabricate alumina–resin hybrid films without a high temperature sintering process. Single- and co-solvent ink systems showing different evaporation behaviors were formulated in order to understand their impacts on the inkjet-printing of the alumina dots, lines, and films. The packing densities of the inkjet-printed alumina films from both ink systems were around 60% which is higher than the value obtained by other conventional methods. Since the high temperature sintering process was avoided, the polymer–resin was infiltrated through the inkjet-printed alumina films by the same inkjet printing as a binder. The microstructures of these hybrid films were investigated in order to confirm if the microvoids in the films were filled with the resin. The dielectric properties of these hybrid films such as relative permittivity and Q -value were measured in order to assess if these hybrid materials is applicable to three-dimensional (3D) system integration as ceramic package substrates.
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Capillary flow as the cause of ring stains from dried liquid drops
Robert D. Deegan, Olgica Bakajin, Todd F. Dupont et al. · Nature · 1997 · 6.3K citations
Jet printing flexible displays
R. A. Street, William S. Wong, S. E. Ready et al. · Materials Today · 2006 · 217 citations · Full text
Engineering, Manufacturing Engineering, Materials Engineering +9