Journal of Vacuum Science & Technology B Microelectronics Processing and Phenomena · 1990 · 33 citations · 0 references
Natural SciencesMaterials EngineeringMaterials ScienceMechanical Behavior Of MaterialsMetallic MaterialsMetallurgyResidual StressStrain HardeningStress TransferStress-strain BehaviorThermal StressesThin Film StrainAluminum MetallizationDirect Stress MeasurementsMetallizationPassivation LayersStress MeasurementThermal ExpansionThermal Expansion MismatchThermal Mismatch
Stress-induced migration is investigated based on direct measurements of average stress in aluminum fine lines. Measured lifetime of the lines is expressed as a power function of the longitudinal tensile stress. The stresses in the fine lines are not directly influenced by the internal stress of the passivation layers, but are caused mainly by thermal expansion mismatch.