Polymer-like Organic Thin Films Deposited by Plasma Enhanced Chemical Vapor Deposition Using the Para-xylene Precursor as Low Dielectric Constant Interlayer Dielectrics for Multilevel Metallization

Abstract

Polymer-like organic thin films were deposited by plasma enhanced chemical vapor deposition (PECVD) using the para-xylene precursor. The effect of the plasma power on the dielectric constant and thermal stability was significant. As the plasma power was increased from 5 W to 60 W, the relative dielectric constant increased from 2.70 to 3.21. The film deposited at a higher plasma power showed higher thermal stability. The film deposited at 60 W was stable up to 450°C. All the deposited films were insulating under an applied field of ≤1 MV/cm.