Japanese Journal of Applied Physics · 2006 · 23 citations · 6 references
EngineeringMaterials EngineeringMaterials ScienceElectronic MaterialsSemiconductor DevicesSemiconductor MaterialsGrain Structure AnalysisSemiconductor DefectsSilicon MaterialsSolar Cell MaterialsSolar CellsX-ray DiffractionCarrier RecombinationCharge Carrier RecombinationElectron Backscatter DiffractionGrain BoundariesGrain Boundary DefectsIron DistributionPolycrystalline SiliconRecombination Centers
To clarify the role of grain boundaries in iron sinks and carrier recombination centers, iron distributions and their chemical states were studied before and after gettering. They were measured by the X-ray microprobe fluorescence and the X-ray absorption in the near-edge structure using the beamline 37XU at the SPring-8 third-generation synchrotron facility. To determine the crystallographic orientation of the grain boundaries, electron backscatter diffraction measurements were performed. The distribution of electric active defects was characterized by electron-beam-induced current measurements. Before gettering, the iron was distributed in the small grain and its chemical state was similar to that of iron oxide. After gettering, the iron was redistributed along the small angle grain boundary, and its chemical state was similar to the iron silicide complexed with the iron oxide. Regarding the electrical activity, high carrier recombination was observed along the small-angle grain boundary. On the contrary, Σ3 grain boundaries were relatively weak impurity sinks and showed low recombination activity.
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Iron contamination in silicon technology
A. A. Istratov, H. Hieslmair, E. R. Weber · Applied Physics A · 2000 · 340 citations
Tonio Buonassisi, A. A. Istratov, H. Hieslmair et al. · Journal of Applied Physics · 2002 · 95 citations
Natural Sciences, Materials Engineering, Materials Science +16