Journal of Electronic Packaging · 2003 · 50 citations · 3 references
EngineeringTensile MechanicsWork HardeningStrength PropertyParametric EquationsStressstrain AnalysisMicrostructure-strength RelationshipThermomechanical AnalysisTensile StrengthSn-pb SoldersMaterials ScienceHot WorkingPlasticityThermomechanical ProcessingMicrostructureStrain RatesStrain Rate EffectsHigh Temperature MaterialsMechanical PropertiesMechanics Of MaterialsHigh Strain Rate
This paper describes the tensile strength and inelastic constitutive relationship of six types of Sn‑Pb solders. Static tension tests on six Sn‑Pb solders (5Sn‑95Pb to 62Sn‑36Pb‑2Ag) were performed at strain rates 0.001–10 %/s and temperatures 313–398 K, and plastic and creep constitutive equations were proposed as functions of temperature and Sn content. Tensile strength rose with strain rate up to 10 %/s, and parametric equations for tensile strength, Young’s modulus, yield stress, and stress amplitude—within ±2 MPa of experiment—were developed as functions of temperature and Sn content.
This paper describes the tensile strength and inelastic constitutive relationship of six types of Sn-Pb solders. Static tension tests were carried using 5Sn-95Pb, 10Sn-90Pb, 40Sn-60Pb, 60Sn-40Pb, 63Sn-37Pb, and 62Sn-36Pb-2Ag solders at the strain rates of 0.001–10.0%/s between temperatures of 313 K and 398 K. Strain rates faster than 2.0%/s were needed to obtain the time-independent Young modulus and yield stress of the solders. Tensile strength increased with increasing strain rates up to 10%/s. Parametric equations for predicting tensile strength, Young’s modulus and yield stress of Sn-Pb solders were developed as a function of temperature and Sn content. Plastic and creep constitutive equations were also proposed as a function of temperature and Sn content. The stress amplitude predicted by these equations agreed with the experimental results within ±2 MPa.
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