Process Signatures – A New Approach to Solve the Inverse Surface Integrity Problem in Machining Processes

E. Brinksmeier, Fritz Klocke, D.A. Lucca, Jens Sölter, Daniel Meyer

Procedia CIRP · 2014 · 145 citations · 16 references

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Concepts

TL;DR

In industrial practice, generating desired surface integrity of high‑performance components remains an iterative, experience‑based process, and although researchers have correlated process parameters with resulting surface integrity, deducing the required parameters from a target surface integrity is still impossible. The paper aims to solve the inverse surface integrity problem by developing process‑independent correlations between thermo‑mechanical loads and material modifications, and to present current insights into identifying Process Signatures for future practical use. The authors introduce Process Signatures, aggregating multi‑scale material modification data linked to thermo‑mechanical loads, and use these process‑independent correlations to formulate a knowledge‑based solution to the inverse surface integrity problem.

Abstract

In industrial practice, the generation of a desired surface integrity of high performance components is still an iterative process based on experience. Despite the findings of researchers correlating the process parameters with the resulting surface integrity, until today, it is not possible to deduce the required process parameters from a given desired surface integrity. This inverse problem shall be addressed by a new approach focusing on process-independent correlations between the thermo-mechanical loads within the workpiece material and the resulting material modifications. The concept of Process Signatures, which aggregate information on material modifications caused by the physical conditions to which a material is subjected to on different levels of scale, are a promising strategy to achieve a knowledge-based solution of the inverse surface integrity problem. This paper presents the current understanding regarding the identification of Process Signatures as well as their potential for future application in practice.

References

16