Solder Joint Reliability Prediction by the Integrated Matrix Creep Method

Abstract

The integrated matrix creep method for predicting the fatigue life of solder joints is presented. The application of the matrix creep life prediction method to a variety of solder joint/load combinations with a comparison to measured reliability data is presented as a validation of this technique. For a leadless chip carrier, the strain distribution in the solder is studied both through modeling and laser Moire interferometry. Finally, using this methodology as a design tool, the fatigue life simulation of a gull wing leaded package is presented in which various design parameters are modified and their effect on the fatigue life determined.