Publication | Closed Access
Innovative packaging solution for power and thermal management of wide-bandgap semiconductor devices in space applications
23
Citations
6
References
2008
Year
Advanced PackagingWide-bandgap SemiconductorElectrical EngineeringChip-scale PackageEngineeringAdvanced Packaging (Semiconductors)Wide-bandgap Semiconductor DevicesPower DeviceApplied PhysicsInnovative Packaging SolutionSpace ApplicationsWide-bandgap SemiconductorsHeat TransferPower ElectronicsElectronic Packaging
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