Comparison of PVD, PECVD & PEALD Ru(-C) films as Cu diffusion barriers by means of bias temperature stress measurements - Concepedia

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Comparison of PVD, PECVD & PEALD Ru(-C) films as Cu diffusion barriers by means of bias temperature stress measurements

12

Citations

6

References

2010

Year

H. Wojcik, U. Merkel, Kurt Richter, Marcel Junige, Christoph Klein, Jürgen Gluch, Matthias Albert, Frans Munnik, Christian Wenzel, Johann W. Bartha

Microelectronic Engineering

Materials EngineeringMaterials ScienceEngineeringDiffusion ResistancePeald RuApplied PhysicsThin FilmsCu Diffusion BarriersChemical Vapor DepositionThin Film Processing

References

	Year	Citations

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