Thermal–mechanical behavior of the bonding wire for a power module subjected to the power cycling test

Selected failure mechanisms of modern power modules

Mauro Ciappa · Microelectronics Reliability · 2002 · 969 citations

Engineering, Electrical Engineering, Maintenance Engineering +13

Failure modes and FEM analysis of power electronic packaging

Hua Ye, Minghui Lin, Cemal Basaran · Finite Elements in Analysis and Design · 2002 · 162 citations

Engineering, Electrical Engineering, Materials Engineering +16

Present problems of power module packaging technology

N.Y.A. Shammas · Microelectronics Reliability · 2003 · 104 citations

Engineering, Electrical Engineering, Manufacturing Engineering +14

Reliability of thick Al wire bonds in IGBT modules for traction motor drives

Jin Onuki, Masahiro Koizumi, Masaki Suwa · IEEE Transactions on Advanced Packaging · 2000 · 90 citations

Natural Sciences, Materials Engineering, Materials Science +17

Packaging factors affecting the fatigue life of power transistor die bonds

John Evans, Jillian Y. Evans · IEEE Transactions on Components Packaging and Manufacturing Technology Part A · 1998 · 31 citations

Engineering, Electrical Engineering, Materials Engineering +17