Concepedia
International Journal of Precision Engineering and Manufacturing · 2014 · 23 citations · 14 references
Natural SciencesMaterials EngineeringMaterials ScienceMaterials ChemistryMetallic MaterialsDiffusion BondingMetalsSolid-liquid InterfacesBonding MechanismsInterdiffusion KineticsNickel-based Alloys
14
Lead-free Solders in Microelectronics
Mulugeta Abtew, Guna S Selvaduray · Materials Science and Engineering R Reports · 2000 · 2K citations
Engineering, Materials Engineering, Materials Science +9
Theory for intermetallic phase growth between cu and liquid Sn-Pb solder based on grain boundary diffusion control
Matt Schaefer, R.A. Fournelle, Jin Liang · Journal of Electronic Materials · 1998 · 327 citations
Natural Sciences, Materials Engineering, Materials Science +14
Rapid formation of intermetallic compounds interdiffusion in the CuSn and NiSn systems
S. Bäder, W. Gust, H. Hieber · Acta Metallurgica et Materialia · 1995 · 221 citations
Natural Sciences, Materials Engineering, Materials Science +16
Semiconductor Joining by the Solid-Liquid-Interdiffusion (SLID) Process
Leonard Bernstein · Journal of The Electrochemical Society · 1966 · 173 citations
Engineering, Materials Engineering, Materials Science +17
Au-In bonding below the eutectic temperature
C.C. Lee, C.Y. Wang, G. Matijasevic · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1993 · 119 citations