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High-Performance Multi-Wafer SiC Epitaxy – First Results of Using a 10x100mm Reactor
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Citations
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References
2010
Year
Materials EngineeringElectrical EngineeringWafer Scale ProcessingEngineeringAdvanced Packaging (Semiconductors)Applied PhysicsDevice ProductionCarbideSemiconductor Device FabricationEpitaxial Layer DepositionElectronic PackagingMicroelectronicsChemical Vapor DepositionFirst Results
In this paper, we present first results of epitaxial layer deposition using a novel warm-wall CVD multi-wafer system AIX 2800G4 WW from AIXTRON with a capability of processing 10x100mm wafers per run. Intra-wafer and wafer-to-wafer homogeneities of doping and thickness for full-loaded 10x100mm runs will be shown and compared to results of the 6x100mm setup of our hot-wall reactor VP2000HW by AIXTRON used for device production since 2001.
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