Middle- and high-permittivity dielectric compositions for low-temperature co-fired ceramics

Abstract

Various middle- and high-permittivity dielectric material systems for LTCC were examined. By designing several borosilicate glass frit systems carefully, we tried to lower the temperature of densification to 875 °C in selected host dielectric materials still maintaining acceptable dielectric properties. The effects of glass addition on the densification, electrical properties, and phase changes in the host dielectric materials were examined.