Ultrarapid Transient‐liquid‐phase Bonding of Al₂O₃Ceramics

Abstract

An effective multilayer interlayer technology for rapid transient-liquid-phase joining of advanced ceramics is demonstrated. Interlayers designed to exhibit rapid interdiffusion, chemical homogenization, and liquid film disappearance, enable rapid and reliable joining of ceramics at reduced temperatures while preserving high-temperature use capability. Processing times as short as 5 min at 1400 °C yield interlayers with a remelt temperature >2200 °C.