IEEE Transactions on Components Hybrids and Manufacturing Technology · 1979 · 20 citations · 3 references
EngineeringElectrical EngineeringMicroelectronicsSemiconductor DevicesVlsi DesignChip PackagingDevice ScalingIntegrated Circuit DesignIntegrated Circuit DevicesIntegrated Circuit FabricationInterconnect TechnologyHigh-density InterconnectsInterconnect ScalingMultichip ModulesVery-large-scale IntegrationVlsi Implementation
The cost of one square inch of ceramic circuit is about the same as one square inch of multilayer printed wiring board containing two signal layers with buried power and ground. But the interconnection density attainable in hybrid is approximately ten times as high. By transferring interconnections from multilayer board to hybrids, the need for excessive layers in MLB is avoided or the total attainable gate count is increased. In comparison with single chip packages, the use of multichip hybrids provides a continuing competitive edge as the scale of integration in silicon is increased year by year.
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