Fabrication of Spindt-type tungsten microtip field emitter arrays with optimized aluminum parting layers

Abstract

Spindt-type field emitter arrays of tungsten microtips have been fabricated by optimizing aluminum parting layers. The aluminum parting layers, which play a crucial role in the subsequent deposition of peeling-free tungsten films, are characterized by varying the deposition conditions. The aluminum parting layer deposited at a high vacuum level has a good stress relaxation effect, and tungsten microtip field emitter arrays, free of peeling, are successfully fabricated and show good electrical characteristics.